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NTLJD3119C
Power MOSFET
20 V/ ? 20 V, 4.6 A/ ? 4.1 A, m Cool t
Complementary, 2x2 mm, WDFN Package
Features
? Complementary N ? Channel and P ? Channel MOSFET
? WDFN Package with Exposed Drain Pad for Excellent Thermal
Conduction
? Footprint Same as SC ? 88 Package
? Leading Edge Trench Technology for Low On Resistance
? 1.8 V Gate Threshold Voltage
? Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
? This is a Pb ? Free Device
Applications
? Synchronous DC ? DC Conversion Circuits
? Load/Power Management of Portable Devices like PDA’s, Cellular
Phones and Hard Drives
? Color Display and Camera Flash Regulators
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
N ? Channel
20 V
P ? Channel
? 20 V
D2
http://onsemi.com
R DS(on) MAX
65 m W @ 4.5 V
85 m W @ 2.5 V
120 m W @ 1.8 V
100 m W @ ? 4.5 V
135 m W @ ? 2.5 V
200 m W @ ? 1.8 V
D1
I D MAX
3.8 A
2.0 A
1.7 A
? 4.1 A
? 2.0 A
? 1.6 A
MARKING
DIAGRAM
Parameter
Drain ? to ? Source Voltage
N ? Ch
P ? Ch
Symbol
V DSS
Value
20
? 20
Unit
V
Pin 1
WDFN6
CASE 506AN
1 JMM G
G
6
1
Gate ? to ? Source Voltage
N ? Channel
Continuous Drain
Current (Note 1)
P ? Channel
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
N ? Channel
Continuous Drain
Current (Note 2)
P ? Channel
Continuous Drain
Current (Note 2)
Steady
State
t ≤ 5s
Steady
State
t ≤ 5s
Steady
State
t ≤ 5s
Steady
State
Steady
State
N ? Ch
P ? Ch
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 85 ° C
V GS
I D
I D
P D
I D
I D
± 8.0
3.8
2.8
4.6
? 3.3
? 2.4
? 4.1
1.5
2.3
2.6
1.9
? 2.3
? 1.6
V
A
A
W
A
A
S1
G1
D2
JM = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
D1
D1
2 5 G2
D2
3 4 S2
(Top View)
T A = 25 ° C
Power Dissipation Steady
(Note 2) State
Pulsed Drain Current N ? Ch t p = 10 m s
P ? Ch
Operating Junction and Storage Temperature
P D
I DM
T J , T STG
0.71
18
? 20
? 55 to
150
W
A
° C
ORDERING INFORMATION
Device Package Shipping ?
NTLJD3119CTAG WDFN6 3000/Tape & Reel
(Pb ? Free)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
NTLJD3119CTBG
WDFN6
(Pb ? Free)
3000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm 2 , 2 oz Cu.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2009
December, 2009 ? Rev. 4
1
Publication Order Number:
NTLJD3119C/D
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